packages/chip/research/mobile_platform_2026/00_index.md
Date: 2026-05-19
This packet records a source-backed survey of phone-class platform building blocks that surround the Eliza E1 SoC: MIPI DSI display, MIPI CSI/ISP camera, PMIC and USB-PD charging, Wi-Fi 7 / BT 6.0 / 5G modem options, UFS storage, open-hardware reference phones, KiCad-based PCB tooling, signal/power integrity practice, sensors, audio subsystem, and thermal/enclosure work.
It is anchored to the existing E1 contracts:
docs/arch/display.md — XR24 framebuffer scaffold and 720x1280 v0 DSI panel target.docs/arch/peripherals.md — external peripheral scaffold table.docs/arch/wifi.md — WiFi/BT external module contract (Murata Type 1DX / CYW4343W class).docs/architecture-optimization/phone-platform.md — coupled-systems work order
for display, camera, PMIC, USB, storage, radios, sensors.package/e1-demo-pinout.yaml, package/bonding/e1_demo_bonding.csv — current
QFN64 demo padframe (no DSI/CSI/UFS/USB-PD bonded today).board/kicad/e1-demo/, board/fpga/ — current board scaffolding scope.01_sources/source_inventory.yaml — provenance, URLs, captured points, and
claim boundaries. Mirrors the schema used in
research/ai_accelerator_sota/01_sources/source_inventory.yaml.02_analysis/display_dsi_dsc.md — MIPI DSI-2 v3, D-PHY / C-PHY, Display
Stream Compression 1.2a/1.3, open DSI controller IP, current LTPO OLED panel
state, DisplayPort-Alt over USB-C.02_analysis/camera_isp_csi.md — MIPI CSI-2 v4, open ISP cores (OpenISP,
CC-Cam, NXP iMX series ISP docs, FPGA ISP projects), V4L2 device tree
bindings, current Sony LYTIA / Samsung ISOCELL / OmniVision sensor families.02_analysis/pmic_and_charging.md — Phone PMIC architecture (Qualcomm,
MediaTek, TI TPS65xxx, Maxim MAX77xxx, Renesas DA9xxx), USB-PD 3.2, PPS,
EPR, fast-charge protocols, open USB-PD test infrastructure.02_analysis/wifi_bt_modem.md — 802.11be Wi-Fi 7, BT 6.0 / BLE Audio /
Auracast, 3GPP Rel-17/18/19 5G modem status, OpenAirInterface and srsRAN
reality vs commercial closed modems.02_analysis/storage_ufs.md — JEDEC UFS 4.1, eMMC 5.1 legacy, UFSHCI 4.0,
M-PHY 5.0, open UFS host controller IP state, NVMe-over-PCIe alternative.02_analysis/open_phone_platforms.md — Pine64 PinePhone Pro, Purism Librem 5,
Phone (1)/(2)/(3a), MNT Pocket Reform, EOMA68, Phasma, FairPhone, lessons
from each open or repair-friendly phone platform.02_analysis/pcb_si_pi.md — KiCad 9, IPC-2581, IPC-7351, IBIS/IBIS-AMI,
LPDDR5X routing rules, breakout vias, PDN target impedance, package-board
co-design.02_analysis/sensors_audio_thermal.md — IMU (BMI/ICM), barometer,
magnetometer, ToF, ambient, fingerprint; I2S/TDM codec ICs (TI, Realtek,
Cirrus), MEMS mic arrays; vapor chamber, phone-class TIM, antenna placement.03_implementation/platform_path_for_e1.md — High/Med/Low confidence
recommendations tied to docs/architecture-optimization/phone-platform.md,
docs/arch/peripherals.md, docs/arch/display.md, docs/arch/wifi.md,
and the v0 DSI / WiFi/BT module gate manifests.Sources are public papers, vendor product briefs, standards-body abstracts, and open-source project READMEs. They do not prove E1 implementation status. Every E1 platform claim still requires the existing contract gates:
package/e1-demo-pinout.yaml (or a successor padframe).package/ with concrete datasheet.docs/architecture-optimization/phone-platform.md.This packet is research and planning evidence only. No claim here moves any
existing gate or manifest in docs/spec-db/, docs/evidence/, or
package/wifi/evidence-gates.yaml.