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Physical, Power, Thermal, Package, PCB, Manufacturing Optimization Work Order

packages/chip/docs/architecture-optimization/physical-power-thermal.md

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Physical, Power, Thermal, Package, PCB, Manufacturing Optimization Work Order

OpenLane/OpenROAD

OpenLane/OpenROAD runs are useful only when the exact run directory, tool image, PDK, corners, constraints, and reports are archived. Preflight success is not PD closure.

IR-drop and PDN

IR-drop, EM, PDN impedance, rail current, and decoupling evidence must be tied to selected workloads, voltage corners, package assumptions, board stackup, and regulator limits.

Static IR-drop, PDN topology, and tool reproducibility are now contract-bound in pd/signoff/run-manifest.schema.json: every release run must declare a psm_ir_drop_report artifact path, a fully populated pdn_topology block matching the strap/ring parameters in pd/openlane/config.sky130.json, and per-tool digests (volare_pdk_digest, klayout_digest, magic_digest, netgen_digest, openroad_digest, yosys_digest, abc_digest, antenna_deck_digest) computed via scripts/record_tool_digests.sh. The schema lets a tool that is genuinely not installed locally be recorded as unavailable with a sibling <tool>_unavailable_reason, but unavailable on its own is fail-closed in scripts/check_pd_signoff.py.

thermal

Thermal closure requires post-route power, package and board model, enclosure assumptions, battery/PMIC losses, measurement points, stop conditions, chamber data, and skin-temperature limits.

The current modeled no-throttle work order is docs/architecture-optimization/soc-optimized-operating-point.yaml. It targets <= 95 C modeled die temperature across the required 14A process corners, but it remains planning evidence only until correlated activity, package, board, enclosure, chamber, and PDK signoff artifacts replace the model.

DFT

DFT, boundary scan, manufacturing test, serialization, calibration, and debug lock state must have station transcripts before fabrication or production claims.