Eliza E1 phone mainboard — KiCad project skeleton

Date: 2026-05-19 Status: skeleton_only. No schematic. No PCB layout. No fabrication.

Claim boundary: This directory is a placeholder for the eventual KiCad 9 project. No schematic / PCB layout / Gerber output exists. Promotion requires schematic, layout, IPC-2581 + STEP + BOM generation via kibot, DRC clean, IBIS-AMI SI simulation, and a fabricated board.

Intent

Mirror the layout of MNT Reform's mainboard/ and PinePhone Pro's pinephone-pro-mainboard/ open-hardware repos:

board/kicad/e1-phone/
  schematic/         # KiCad 9 schematic sheets (.kicad_sch)
  pcb/               # KiCad 9 PCB layout (.kicad_pcb)
  library/           # Project-local symbol + footprint + 3D libraries
  production/        # Fabrication outputs (Gerbers, IPC-2581, BOM, STEP)
  kibot.yaml         # Automation config for production outputs
  README.md          # This file

kibot.yaml plan

The committed kibot.yaml is a skeleton; it does not yet point at any schematic or PCB file because those do not exist. Outputs planned:

• gerbers/: standard Gerber X2 set + drill files for an 8-layer 0.8 mm board.
• ipc-2581/: IPC-2581 Revision C package (manufacturer-neutral fabrication).
• bom/: Interactive HTML BOM + iBOM + CSV BOM with vendor PNs.
• step/: Mechanical 3D model for case integration review.
• pos/: Pick-and-place CSV for SMT assembly.
• pdf/: schematic PDF + layout PDF for review.

See kibot.yaml in this directory.

Linked bindings

The mainboard schematic, when written, must consume these planning bindings as authoritative:

• package/e1-demo-pinout.yaml — SoC pinout (when bonded out beyond the QFN64 demo).
• package/wifi/murata-1dx-sdio.yaml — Wi-Fi/BT module.
• package/display/v0-dsi-720x1280.yaml — DSI panel.
• package/pmic/da9063.yaml — PMIC.
• package/usb-pd/tps65987.yaml — USB-PD controller.
• package/charger/max77860.yaml — Charger.
• package/sensors/v0-sensors.yaml — Sensors.
• package/audio/v0-codec.yaml — Audio codec + amp + mics.
• docs/board/power-tree.md — Rail-by-rail PDN intent.
• docs/board/pdn-budget.md — PDN target-impedance budget.
• docs/board/antenna-plan.md — Antenna placement and isolation.
• docs/board/thermal-stack.md — Mainboard thermal stack.

What this is not

• This is not a working KiCad project. Opening this directory in KiCad 9 shows an empty project.
• This is not a fabricated board. None of the parts in the bindings above are bonded into a working schematic or PCB.
• This is not a release. Treat as a forward planning placeholder.

Open decisions

1. SoM vs mainboard split (MNT Pocket Reform pattern) per research/mobile_platform_2026/03_implementation/platform_path_for_e1.md M-4: "Document package/som-vs-mainboard-split.md."
2. Board outline / mechanical envelope (depends on case selection).
3. Layer stack-up: 8L 0.8 mm vs 10L 0.6 mm vs HDI 12L (cost vs density).