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E1 chip tapeout-readiness checklist

packages/chip/docs/tapeout-checklist/e1-chip.md

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E1 chip tapeout-readiness checklist

The e1 chip is ready as a pipeline milestone when:

  • pd/signoff/manifest.yaml records no blocked gates for PD release, tapeout release, or board fabrication release.
  • RTL syntax/elaboration passes.
  • cocotb register tests pass.
  • Verilator smoke test passes.
  • DMA and NPU formal checks pass.
  • Yosys synthesis emits a netlist and area report.
  • OpenLane or OpenROAD either completes or has a documented tool/PDK blocker.
  • PD signoff archives final GDS/DEF/netlist/SDC and clean or waived DRC, LVS, antenna, and STA reports.
  • SI/PI evidence is archived for package models, board-level signal integrity, and power integrity.
  • PDN/current budget evidence is archived for post-route power, IR-drop/EM, decoupling, and board current limits.
  • Padframe/package evidence is archived for released IO cells, ESD/corner cells, package drawing, bond diagram, and board footprint.
  • docs/manufacturing/real-world-verification-gaps.yaml has no remaining release-blocking physical, package, SI/PI, PDN/current-budget, board-fabrication, or first-article gaps.
  • Memory map and interrupt map match the tests.
  • All generated reports are stored under build/ or pd/reports/.