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Competitor Snapshot and 2028 Target Envelope

packages/chip/docs/spec-db/competitor-2028-target.md

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Competitor Snapshot and 2028 Target Envelope

Date: 2026-05-17

Purpose: compare the current Eliza RAM/CPU/NPU scaffold against public Snapdragon/Apple/MediaTek/Google-class mobile SoCs, then set a 2028 target envelope for an open RISC-V AI phone SoC. This is a planning artifact, not an implementation claim.

Source Rules

  • Prefer vendor pages for architecture, memory type, and accelerator feature claims.
  • Treat third-party benchmark tables and RAM/bandwidth figures as context, not proof for design signoff.
  • Do not compare TOPS without precision, sparsity, clocks, power, thermal state, memory bandwidth, and CPU fallback.
  • Mark any forward-looking 2028 number as an Eliza target assumption, not as an observed competitor number.

Workstream Breakdown

WorkstreamOwned questionArtifact role
RAM / memoryWhat memory capacity, bandwidth, cache, coherency, and IOMMU envelope is needed for an AI phone AP?Convert public LPDDR5X-class signals into a 2028 target and list evidence needed before any bandwidth/capacity claim.
CPUWhat open RISC-V AP class is needed to be phone-credible versus 2025-2026 flagship Arm/custom cores?Compare current tiny CPU scaffold to flagship CPU topology and define the minimum Linux-capable RV64GC target.
NPUWhat accelerator class is needed for on-device LLM/multimodal workloads?Compare current MMIO NPU prototype to public low-precision/NPU software signals and define a target envelope.
Evidence / claimsWhat must stay blocked until silicon/software proof exists?Separate sourced competitor observations, Eliza assumptions, and current repo non-claims.

Sourced Assumptions

AssumptionSource basisConfidenceHow it is used
2025-2026 Android flagship CPU class is 8-core big/performance-heavy, with Qualcomm using 2 Prime + 6 Performance Oryon cores and MediaTek using 1 C1-Ultra + 3 C1-Premium + 4 C1-Pro.Qualcomm product brief and MediaTek product page.High for topology and clocks published by vendors.Sets the minimum bar for a credible 2028 RISC-V AP target: multiple Linux-capable application cores, not the current tiny CPU scaffold.
Current flagship mobile RAM is LPDDR5X-class, with Qualcomm publishing LPDDR5x up to 5300 MHz and up to 24 GB density, MediaTek publishing LPDDR5X 10667, Google Pixel 10-class coverage reporting LPDDR5X, and third-party Apple A19 Pro coverage reporting LPDDR5X.Qualcomm, MediaTek, Android Central, Notebookcheck.High for vendor memory type, medium for third-party capacity/bandwidth details.Justifies 16 GB minimum, 24 GB stretch, and 120-180 GB/s planning envelope for 2028.
Public mobile AI direction is low precision, accelerator concurrency, memory locality, and framework integration rather than TOPS alone.Qualcomm Hexagon NPU precision/features, MediaTek NPU 990/CIM claims, Apple Neural Engine/GPU Neural Accelerators, Google TPU/Gemini Nano context.High for named vendor features; medium for performance uplift claims without full power/thermal data.Drives INT8/INT4/INT2/FP8 targets, local SRAM, command queues, compiler/runtime evidence, and CPU fallback gates.
Synthetic benchmarks are not enough for design signoff.Android Central Tensor G5 benchmark discussion and source-rules policy.High as an evidence policy, not a numeric claim.Requires power, thermal, model hash, unsupported-op, and fallback evidence before any performance claim.

Competitor Public Data Table

SoC classPublic CPU signalPublic RAM / memory signalPublic NPU / AI signalPlanning implication
Qualcomm Snapdragon 8 Elite Gen 5Qualcomm lists 2 Prime Oryon cores up to 4.74 GHz and 6 performance cores up to 3.62 GHz.Qualcomm lists LPDDR5x up to 5300 MHz and up to 24 GB density; Notebookcheck reports 84.8 GB/s derived from the 64-bit LPDDR5X-5300 controller.Qualcomm lists Hexagon NPU, fused AI accelerator architecture, scalar/vector/accelerator configuration, INT2/INT4/INT8/INT16/FP8/FP16 support, and 37% faster NPU versus prior generation.A 2028 target must include low-precision AI, CPU-side matrix help, concurrency, memory virtualization, and at least 24 GB-class memory planning.
Apple A19 ProApple lists 6 CPU cores: 2 performance and 4 efficiency.Apple does not list RAM on its tech-spec page; Notebookcheck reports 12 GB LPDDR5X-9600 and about 75.8 GB/s.Apple lists a 16-core Neural Engine and GPU Neural Accelerators.CPU single-thread strength and GPU/NPU cooperation matter; public RAM figures may require secondary sourcing.
MediaTek Dimensity 9500MediaTek lists 1 Arm C1-Ultra, 3 C1-Premium, 4 C1-Pro, plus 16 MB L3 and 10 MB SLC.MediaTek lists LPDDR5X 10667 and UFS 4.1 four-lane storage.MediaTek lists NPU 990, 56% reduced peak power use, over 2x faster token generation, 4K text-to-image, and CIM-based NPU.Memory locality, large caches, token-generation power, and model-serving software are as important as peak math.
Google Tensor G5 / Pixel 10 classAndroid Central reports 1 Cortex-X4, 5 Cortex-A725, and 2 Cortex-A520, with Tensor G5 on TSMC 3 nm.Android Central reports LPDDR5X, 12 GB RAM on Pixel 10, and 16 GB RAM on Pixel 10 Pro.Android Central reports a 4th-generation TPU, up to 60% more TPU power than Tensor G4, and Gemini Nano improvements; it also notes Tensor G5 is not a benchmark leader.Strong Android AI integration can be valuable even below raw flagship CPU/GPU performance.

Source confidence:

  • High: vendor-published CPU topology, memory type, and named NPU features.
  • Medium: third-party RAM capacity and bandwidth figures where the vendor page does not publish them.
  • Low for design budgeting: synthetic benchmark scores unless the test device, thermal state, power, and software version are archived.

2028 Spec Table

This envelope is intentionally below closed flagship ambition in modem/GPU/ISP integration, but high enough to be credible for an open RISC-V AI phone AP if backed by real silicon and software evidence.

Area2028 target envelopeEvidence required before claim
CPU4-8 Linux-capable RV64GC application cores, preferably OoO for big cores; at least one management/security RISC-V core; vector or matrix extension strategy documented.OpenSBI log, Linux boot log, ISA string, privilege/MMU tests, interrupt/timer evidence, sustained CPU benchmarks with power and thermal traces.
Memory / RAM16 GB minimum product target, 24 GB stretch; LPDDR5X/LPDDR6-class external memory; at least 120 GB/s sustained usable bandwidth target and 180 GB/s stretch for AI-heavy SKU; 16-32 MB shared system cache.DRAM controller/PHY evidence, training logs, board routing, memory test, STREAM/lmbench/fio, display+NPU contention tests, IOMMU/coherency validation.
NPUDense INT8 sustained 80 TOPS minimum; dense INT8 peak 160 TOPS target; INT4/INT2 and FP8 support; at least 64 MiB local SRAM; command queues, DMA, IOMMU isolation, per-context faults, and thermal counters.MLPerf Mobile or equivalent, TFLite/ExecuTorch/IREE path, unsupported-op report, CPU fallback under 1%, power/thermal traces, model hashes, Android HAL/VTS evidence.
Phone AI experience3B INT4 LLM at 100 tok/s sustained target; 7B INT4 at 30 tok/s stretch; multimodal encoder under 30 ms; concurrent camera AI/display/audio QoS.End-to-end app traces, token latency histograms, camera/display concurrent tests, scheduler/QoS counters, battery and skin-temperature logs.

Gap Table

AreaCurrent Eliza state2028 target gapBlocked claim
CPUTiny executable RISC-V subset over a 32-bit AXI-Lite manager. It fetches, runs a small integer subset, and halts fail-closed. Not Linux-capable.Missing RV64GC application cores, privilege/CSR/trap model, MMU, caches, atomics, timer/software interrupts, coherent memory, OpenSBI/Linux boot evidence.No flagship CPU, Android AP, or Linux-capable CPU performance claim.
RAM / memorySRAM-backed DRAM aperture for tests. Docs reserve 0x8000_0000; current model is not real DRAM capacity, timing, LPDDR PHY, training, refresh, or bandwidth evidence.Missing LPDDR-class controller/PHY, 16-24 GB capacity plan, 100+ GB/s bandwidth, cache hierarchy, UMA/coherency, IOMMU, QoS, bandwidth counters, thermal/power evidence.No LPDDR, RAM capacity, memory bandwidth, UMA, or AI/display contention claim.
NPUMMIO datapath with scalar ops, DOT4_S8, DOT8_S4, bounded 64-byte scratchpad GEMM_S8, interrupt, and counters.Missing tensor command queues, DMA-fed scratchpad, large SRAM, systolic/vector tiles, INT2/FP8, compiler backend, Android delegate/HAL proof, power/area model, sustained benchmarks.No mobile tensor NPU, TOPS, Android accelerator, or sustained AI workload claim.

Target assumptions:

  • 2028 mobile AI will be constrained by memory locality, thermal envelope, and software coverage more often than by raw peak math.
  • An open RISC-V phone SoC does not need to match closed modem/GPU/ISP stacks to be useful, but it does need credible Linux/Android boot, memory, and NPU evidence.
  • 24 GB RAM is a stretch target because Qualcomm publicly supports up to 24 GB density in the Snapdragon 8 Elite Gen 5 class, while Tensor/Apple public device context is lower.
  • The 120 GB/s sustained and 180 GB/s stretch memory-bandwidth targets are Eliza planning assumptions derived from public LPDDR5X-class bandwidths and AI/display concurrency needs; they are not observed e1-chip results.
  • The NPU envelope is aligned with docs/spec-db/npu-2028-target.yaml, but this artifact keeps CPU and memory targets in the same comparison frame.
  • Qualcomm product brief: Snapdragon 8 Elite Gen 5 CPU clocks, Hexagon NPU feature set, low-precision support, LPDDR5x up to 5300 MHz, and up to 24 GB memory density. Source: Qualcomm Snapdragon 8 Elite Gen 5 product brief
  • MediaTek product page: Dimensity 9500 CPU cluster, LPDDR5X 10667, UFS 4.1, NPU 990, power/token-generation claims, and CIM-based NPU. Source: MediaTek Dimensity 9500
  • Apple support page: A19 Pro 6-core CPU, 6-core GPU with Neural Accelerators, and 16-core Neural Engine. Source: Apple iPhone 17 Pro tech specs
  • Android Central Tensor G5 coverage: Tensor G5 CPU topology, LPDDR5X, Pixel 10 and Pixel 10 Pro RAM context, TPU improvement claims, and benchmark caveats. Source: Google Tensor G5 coverage
  • Notebookcheck context only: Snapdragon 8 Elite Gen 5 memory bandwidth and Apple A19 Pro RAM/bandwidth figures where vendor pages do not publish the exact number. Sources: Snapdragon 8 Elite Gen 5 Notebookcheck, Apple A19 Pro Notebookcheck

Claim Boundaries

  • The current repo does not implement a flagship CPU, DRAM subsystem, or mobile NPU.
  • QEMU/Renode, AXI-Lite SRAM, and MMIO NPU tests are scaffold evidence only.
  • The 2028 envelope is a target for architecture planning and evidence gates, not proof that the design meets those numbers.
  • Public competitor figures are not copied as implementation requirements; they are context for an open RISC-V target envelope.
  • Any future claim must cite the exact artifact, command, device, clock, power, thermal state, software build, and source revision used to produce it.

Open Blockers

  • CPU: integrate or generate a Linux-capable RV64GC AP, then prove OpenSBI and Linux boot on the target memory map.
  • RAM: replace SRAM-backed DRAM models with a real external memory controller/PHY plan, board routing, training logs, and bandwidth evidence.
  • NPU: replace MMIO scalar/scratchpad prototype with a tensor accelerator, compiler/runtime path, Android HAL evidence, and sustained power/thermal benchmarks.
  • Product: keep modem, WiFi, ISP, GPU, PMIC, certification, and Android compatibility claims out of scope until each has its own evidence gate.