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E1 Demo Local DFM Draft Review

packages/chip/docs/manufacturing/evidence/board/e1-demo-local-dfm-draft.md

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E1 Demo Local DFM Draft Review

Status: draft local review, not vendor DFM signoff Board revision: r0-nonrelease KiCad source: board/kicad/e1-demo Fab export: board/reports/fab/e1-demo-2026-05-17 Review date: 2026-05-18 Reviewer: local manufacturing preflight Disposition: blocked for fabrication release

Scope

This review records locally solvable DFM checks against the non-release KiCad planning board and dated KiCad CLI export. It does not replace assembly-house DFM, package-vendor land-pattern approval, or first-article inspection.

Inputs reviewed:

  • board/kicad/e1-demo/e1-demo.kicad_sch
  • board/kicad/e1-demo/e1-demo.kicad_pcb
  • board/kicad/e1-demo/e1_demo_planning.pretty/e1_demo_qfn64_planning.kicad_mod
  • board/reports/fab/e1-demo-2026-05-17/e1-demo-erc-report.txt
  • board/reports/fab/e1-demo-2026-05-17/e1-demo-drc-report.txt
  • board/reports/fab/e1-demo-2026-05-17/gerbers/
  • board/reports/fab/e1-demo-2026-05-17/drill/
  • board/reports/fab/e1-demo-2026-05-17/e1-demo-bom.csv
  • board/reports/fab/e1-demo-2026-05-17/e1-demo-position.csv
  • board/reports/fab/e1-demo-2026-05-17/pdf/e1-demo-fab-drawing.pdf

Local Findings

Pass for local draft package:

  • KiCad project, schematic, PCB, BOM, position, Gerber, drill, command transcript, tool-version transcript, and fab drawing artifacts are archived under the dated export directory.
  • Board files carry explicit non-release planning markers.
  • The SoC footprint is isolated in a project-local planning footprint library.
  • BOM line for U1 states that the footprint is a placeholder and must be derived from the package drawing before fabrication.

Release blockers:

  • U1 footprint is not vendor-derived and has no package drawing checksum.
  • No package-vendor courtyard, paste-mask, stencil, exposed-pad, or coplanarity limits are archived.
  • No assembly-house DFM report is archived.
  • No IPC land-pattern calculation or package drawing revision is archived.
  • No panelization, fiducial, tooling-hole, or assembly process constraints have been accepted by the board vendor.

Required Release Evidence

  • Vendor package drawing and land-pattern source with immutable revision and checksum.
  • Regenerated KiCad footprint from that source, reviewed against pin-1 orientation, pad pitch, exposed-pad geometry, solder-mask expansion, paste aperture, and courtyard.
  • Clean ERC/DRC rerun after footprint regeneration.
  • Assembly-house DFM report for the exact Gerber, drill, BOM, position, and fab drawing archive intended for purchase.
  • Explicit disposition that supersedes this draft local review.